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The current direction of development of diamond PDC cutter


1, polycrystalline diamond layer continues to thicken, from the initial development to the present lack of 1mm 2-4mm, life of the product increases.

2, diamond grains is getting smaller, wear resistance and impact resistance improving overall performance.

3, or by optimizing the process off Co, increasing the heat-resistant layer and other processes, improve thermal stability. 4, the interface structure optimization, improving the interfacial stress.

5, increasing the diameter of the product, improve the efficiency of the synthesis.

6, improve the sintering effect, reducing the difference in performance.

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